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UID:20260524T024520EDT-8940JdmiMi@132.216.98.100
DTSTAMP:20260524T064520Z
DESCRIPTION:Abstract\n\nEmerging heterogeneous chiplet-based platforms\, su
 ch as interposers\, three-dimensional integrated circuits (3D ICs)\, and S
 i-IF\, where integrated numerous small chips on an interconnect fabric to 
 build scalable computing platforms\, have been made possible by recent bre
 akthroughs in integration technology. Chiplet-based systems outperform sys
 tems-on-chip in terms of power efficiency\, density\, communication speed\
 , and yield\, particularly for demanding workloads such as deep learning. 
 To address the specific needs of emerging chiplet-based platforms\, such a
 s modularity\, scalability\, timing\, power\, and area constraints\, new d
 esign strategies\, comprising essential circuit-level services such as pow
 er management and delivery and system-level services such as hardware secu
 rity modules must be carefully designed. This research presents novel desi
 gn methodologies for key design aspects of the emerging 3D and chiplet-bas
 ed platforms\, including power delivery\, thermal management\, and hardwar
 e security. In other words\, the proposed research plan targets security-\
 , power-\, and thermal-aware tools and methodologies that support chiplet-
 based platforms.\n
DTSTART:20241202T193000Z
DTEND:20241202T213000Z
LOCATION:Room 603\, McConnell Engineering Building\, CA\, QC\, Montreal\, H
 3A 0E9\, 3480 rue University
SUMMARY:PhD defence of Yousef Safari – Design Methodologies for Heterogeneo
 us Integration Platforms
URL:/ece/channels/event/phd-defence-yousef-safari-desi
 gn-methodologies-heterogeneous-integration-platforms-361513
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